StarTech.com 20g Tube CPU Thermal Paste Grease Compound for Heatsinks
Part number HEATGREASE20
CPU HEAT SINK THERMAL PASTE COMPUTER COMPOUND CPU HEAT SINK
- Ceramic-based compound containing silicone
- Thermal conductivity of more than 1.066 W/m-K
- Manufacturer
- StarTech.com
- Part number
- HEATGREASE20
- Condition
- New
- Category
- System Components › Motherboards
- 1GPA category
- Hardware
Overview
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
Specifications
| Thermal conductivity | 1.066 W/m·K |
|---|---|
| Product colour | White |
| Thermal resistance | 0.195 °C/W |
| Specific gravity | 2.3 g/cm³ |
| Operating temperature (T-T) | -20 - 100 °C |
| Storage temperature (T-T) | -50 - 100 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Evaporation (@ 200°C/24h) | 0.001% |
|---|---|
| Bleed (@ 200°C/24h) | 0.005% |
| Compliance certificates | RoHS |
| Width | 72 mm |
|---|---|
| Depth | 18 mm |
| Height | 18 mm |
| Weight | 24 g |
| Package width | 79 mm |
|---|---|
| Package depth | 147 mm |
| Package height | 21 mm |
| Package weight | 37 g |
| Master (outer) case width | 434 mm |
|---|---|
| Master (outer) case length | 345 mm |
| Master (outer) case height | 349 mm |
| Products per master (outer) case | 230 pc(s) |
Product photos and overview provided by the manufacturer through Icecat. Confirm specifications with your rep before ordering.